By Yoshihiko Imanaka
In recent times, Low Temperature Cofired Ceramics (LTCC) became an enticing know-how for digital parts and substrates which are compact, gentle, and supply high-speed and performance for transportable digital units equivalent to mobile telephones, own electronic assistants (PDA) and private pcs used for instant voice and knowledge verbal exchange in quickly increasing cellular community platforms. LTCC are specially compatible for the excessive frequency circuits required for high-speed info communications.
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Additional resources for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
6-12.  R. H. Katz, “Adaptation and mobility in wireless information systems,” IEEE Personal Comm. Quarter, (1994), pp. 6-17.  K. Oida, “Action for Development of Frequency Resources,” The Journal of the institute of Electronics, Information, and Communication Engineers, Vol. 71, No. 5, (1988), pp. 457463.  “Restructuring System on a Chip Strategy with Package Technology as the New Innovation,” NIKKEI MICRODEVICES, No. 189 March (2001), pp. 113-132.  “Activity Around Technology to Embed Devices Internally in PCB’s Suddenly Increases,” NIKKEI ELECTRONICS, No.
5, (1988), pp. 457463.  “Restructuring System on a Chip Strategy with Package Technology as the New Innovation,” NIKKEI MICRODEVICES, No. 189 March (2001), pp. 113-132.  “Activity Around Technology to Embed Devices Internally in PCB’s Suddenly Increases,” NIKKEI ELECTRONICS, No. 842, March 3(2003), pp. 57-64.  H. Stetson, “Multilayer Ceramic Technology,” Ceramics and Civilization, No. 3, Oct. (1987), pp. 307-322,  W. J. S. Patent No. 3,192,086, June 1965.  H. S. 3,189,978, June 1965.
In addition to these characteristics, and in order for components to maintain stable characteristics in their environment of use and for mounted components to retain reliable interconnections, it is important for the ceramics to have low thermal expansion (in particular, they should have a thermal expansion coefficient close to that of the silicon material of the mounted components). Additionally, they must have sufficient strength to withstand the stresses of product assembly during manufacture, as well as while in use.
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology by Yoshihiko Imanaka